ChengDu Hi-Tech Industrial Development Zone

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Chengdu Hi-Tech Comprehensive Bonded Zone

Chengdu Hi-Tech Comprehensive Bonded Zone is an integration and expansion of the existing Sichuan Chengdu EPZ and Chengdu Bonded Logistics Center (Type B), with a total planned area of 4.68 km2. The comprehensive bonded zone was approved by the State Council in Oct. 2010,and passed acceptance check in Feb. 2011. Companies inside the zone can conduct various business including international transit, delivery, purchase and distribution, financial services, test and repair, port transactions and product showcasing. Import goods will be bonded and export goods will enjoy tax rebate inside the zone, which provides favorable environment for large exporters. Companies such as Intel, Foxconn, Dell, TI, SMIC, Unisem, Molex, MPS and Timken already have presence in the zone. In 2011, the total import and export value reached USD 18.45 billion ranking first in mid-west China. The customs clearance of the comprehensive bonded zone operates 24*7, with each deal cleared in less than 2 hours. Paperless clearance system is adopted, reducing the clearance time to 20-30 minutes.